Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto

US10168391B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Giuliano Angelo Babulano · Ottobrunn, DE
• Jens Oetjen · Borgo San Lazzaro, DE
• Liu Chen · Munich, DE
• Toni Salminen · Munich, DE
• Stefan Mieslinger · Kottgeisering, DE
• Markus Dinkel · Unterhaching, DE
• Martin Gruber · Schwandorf, DE
• Franz Jost · Stuttgart, DE
• Thorsten Meyer · Regensburg, DE
• Rainer Markus Schaller · Kelheim, DE

Key dates

• Filing date: Feb 22, 2016
• Grant date: Jan 1, 2019
• Expiry date: Oct 2, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1815
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.