Electronic device and method for fabricating the same
US10170691B2 · kind B2 · utility
1Cited by
1References
19Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 20, 2016 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Dec 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N50/85
Abstract
Provided is a method for fabricating an electronic device including a variable resistance element which includes a free layer formed over a substrate and having a changeable magnetization direction, a pinned layer having a pinned magnetization direction, a tunnel barrier layer interposed between the free layer and the pinned layer, and a magnetic correction layer suitable for reducing the influence of a stray field generated by the pinned layer. The method may include: cooling the substrate; and forming the magnetic correction layer over the cooled substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.