Substrate processing systems, apparatus, and methods with factory interface environmental controls
US10192765B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2014 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Dec 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67772
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.