System for inspecting a backside of a wafer
US10215707B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2016 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Jan 13, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8825
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An inspection system for inspection a surface of a substrate, the inspection system may include an interface for holding the substrate; a movement mechanism for moving the interface, thereby moving the substrate between different positions; a bright field light source that is configured to illuminate different bright field illuminated parts of the surface of the substrate when the substrate is positioned at the different positions; at least one dark field light source that is configured to illuminate different dark field illuminated parts of the surface of the substrate when the substrate is positioned at the different positions; and a camera that is configured to: (a) generate bright field detection signals in response to light that is detected by the camera as a result of the illumination of the different bright field illuminated parts; and (b) generate dark field detection signals in response to light that is detected by the camera as a result of the illumination of the different dark field illuminated parts; and wherein light that is detected by the camera as the result of the illumination of the different bright field illuminated parts and as the result of the illumination of …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.