Reflow interconnect using Ru
US10217664B2 · kind B2 · utility
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23References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2018 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Mar 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76883
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming conductive structures for a semiconductor device includes depositing a reflow liner on walls of trenches formed in a dielectric layer and depositing a reflow material on the reflow liner. The reflow material is reflowed to collect in a lower portion of the trenches. The depositing and the reflowing steps are repeated until the trenches are aggregately filled with the reflow material. The reflow material is planarized to form conductive structures in the trenches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.