Inventor · Yorktown Heights, NY, US

Wei Wang

20Patents
3h-index
28Co-inventors
59Inventor score

Filing activity: Jul 24, 2009 → Dec 3, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US9786603B1 Surface nitridation in metal interconnects Electricity 9 Active
US9806018B1 Copper interconnect structures Electricity 4 Active
US9960078B1 Reflow interconnect using Ru Electricity 3 Active
US10128147B2 Interconnect structure Electricity 2 Active
US9887160B2 Multiple pre-clean processes for interconnect fabrication Electricity 2 Active
US10581696B2 Intelligent information adapter generation for service management Electricity 2 Active
US9184322B2 Titanium incorporation into absorber layer for solar cell Emerging Cross-Sectional Technologies 1 Active
US9953864B2 Interconnect structure Electricity 0 Active
US10224275B2 Copper interconnect structures Electricity 0 Active
US10361153B2 Surface nitridation in metal interconnects Electricity 0 Active
US10217664B2 Reflow interconnect using Ru Electricity 0 Active
US9639849B2 Allocating commodity shelves in a supermarket Physics 0 Active
US9129318B2 System and method for allocating suppliers using geographical information system and supplier capability Physics 0 Active
US10068846B2 Surface nitridation in metal interconnects Electricity 0 Active
US9754010B2 Generation of cube metadata and query statement based on an enhanced star schema Physics 0 Active
US10211101B2 Reflow interconnect using Ru Electricity 0 Active
US10615116B2 Surface nitridation in metal interconnects Electricity 0 Active
US9831182B2 Multiple pre-clean processes for interconnect fabrication Electricity 0 Active
US11886468B2 Fingerprint-based data classification Physics 0 Active
US10938669B2 Intelligent information adapter generation for service management Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.