Wafer drying apparatus and wafer drying method
US10229841B2 · kind B2 · utility
0Cited by
28References
8Claims
0Family size
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Key dates
| Filing date | Jun 17, 2016 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Feb 26, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF26B2200/12
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A wafer drying apparatus capable of preventing formation of a watermark is disclosed. The wafer drying apparatus includes: a conveying mechanism configured to convey a wafer in a drying chamber; an inert-gas jet nozzle disposed above the conveying mechanism and configured to form a descending jet of an inert gas; and a liquid suction nozzle disposed upstream of the inert-gas jet nozzle with respect to a conveying direction of the wafer. A distance between the liquid suction nozzle and a surface of the wafer when the wafer is being conveyed by the conveying mechanism is in a range of 1 mm to 2 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.