Patent · US Active

Double sided buff module for post CMP cleaning

US10229842B2 · kind B2 · utility

1Cited by

3References

18Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Clinton SAKATA · San Jose, US
Hui Chen · Burlingame, US
Jim K. Atkinson · Los Gatos, US
Tomohiko Kitajima · San Jose, US
Brian J. Brown · Eastleigh, GB

Key dates

Filing date	Jul 26, 2013
Grant date	Mar 12, 2019
Priority date	—
Expiry date	Sep 19, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67046
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A buff module and method for using the same are provided. In one embodiment, a buff module includes housing having an interior volume, a plurality of drive rollers and a pair of buff heads. The drive rollers are arranged to rotate a substrate within the interior volume on a substantially horizontal axis. The buff heads are disposed in the housing, each buff head rotatable on an axis substantially aligned with the horizontal axis and movable to a position substantially parallel with the horizontal axis.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.