Method for embossing of substrates
US10239253B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2015 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Jan 3, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/24
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for embossing a structure material on a substrate disposed within a device having side walls, a base plate and a cover that define a working space that is isolated from a surrounding environment. The method includes the steps of: a) moving the substrate using a first calibration means and aligning the substrate with an application means, b) applying the structure material to the substrate, c) moving the substrate using a second calibration means that is located at least partially in the working space wherein the substrate is disposed within the working space and is aligned with an embossing means that is located at least partially in the working space, and d) embossing the structure material on the substrate while the substrate is in the working space using the embossing means, wherein the working space has a defined atmosphere, before and during the step of embossing, without interruption.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.