Thomas Glinsner
11Patents
2h-index
20Co-inventors
46Inventor score
Filing activity: Nov 7, 2008 → Mar 16, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10954122B2 | Method for bonding of at least three substrates | Electricity | 2 | Active |
| US10239253B2 | Method for embossing of substrates | Performing Operations; Transporting | 2 | Active |
| US9116424B2 | Device for embossing of substrates | Performing Operations; Transporting | 2 | Active |
| US8763239B2 | System for uniform structuring of substrates | Emerging Cross-Sectional Technologies | 2 | Active |
| US9764511B2 | Nanostructure die, embossing roll, device and method for continuous embossing of nanostructures | Performing Operations; Transporting | 1 | Active |
| US9082059B2 | Method and device for producing individually coded read patterns | Physics | 0 | Active |
| US8931624B2 | Transport system for accommodating and transporting flexible substrates | Performing Operations; Transporting | 0 | Active |
| US10707059B2 | Method and device for plasma treatment of substrates | Electricity | 0 | Active |
| US8828147B2 | Device and method for loosening a polymer layer from a surface of a substrate | Electricity | 0 | Active |
| US11472212B2 | Device and method for embossing micro- and/or nanostructures | Physics | 0 | Active |
| US9960058B2 | Device and method for treating substrate surfaces | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.