Magnet configurations for radial uniformity tuning of ICP plasmas
US10249479B2 · kind B2 · utility
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14References
17Claims
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Key dates
| Filing date | Dec 31, 2015 |
| Grant date | Apr 2, 2019 |
| Priority date | — |
| Expiry date | May 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3211
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein generally relate to plasma process apparatus. In one embodiment, the plasma process apparatus includes a plasma source assembly. The plasma source assembly may include a first coil, a second coil surrounding the first coil, and a magnetic device disposed outside the first and inside the second coil. The magnet enables additional tuning which improves uniformity control of the processes on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.