Substrate support assembly
US10257887B2 · kind B2 · utility
4Cited by
98References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2017 |
| Grant date | Apr 9, 2019 |
| Priority date | — |
| Expiry date | Dec 13, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C13/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate support assembly comprises a ceramic puck comprising a substrate receiving surface, and having embedded therein: (i) an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and (ii) a heater to heat the substrate, the heater comprising a plurality of spaced apart heater coils. A compliant layer bonds the ceramic puck to a base, the compliant layer comprising a silicon material. The base comprises a channel to circulate fluid therethrough, the channel having a channel inlet and a channel terminus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.