Method of fabricating an electromechanical structure including at least one mechanical reinforcing pillar

US10290721B2 · kind B2 · utility

Assignee

• COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

• Vincent Larrey · La Murette, FR
• Francois Perruchot · Issy-les-Moulineaux, FR
• Bernard Diem · Échirolles, FR
• Laurent Clavelier · Grenoble, FR
• Philippe Robert · Grenoble, FR

Key dates

• Filing date: Jun 7, 2013
• Grant date: May 14, 2019
• Expiry date: Jan 17, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

The invention provides a method of fabricating an electromechanical structure presenting a first substrate including a layer of monocrystalline material covered in a sacrificial layer that presents a free surface, the structure presenting a mechanical reinforcing pillar in the sacrificial layer, the method including etching a well region in the sacrificial layer to define a mechanical pillar; depositing a first functionalization layer of the first material to at least partially fill the well region and cover the free surface of the sacrificial layer around the well region; depositing a second material different from the first material for terminating the filling of the well region to thereby cover the first functionalization layer around the well region, planarizing the filler layer, the pillar being formed by the superposition of the first material and second material in the well region; and releasing the electromechanical structure by removing at least partially the sacrificial layer.