Method and apparatus for polishing a substrate
US10307882B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2016 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Mar 20, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.