Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
US10312173B2 · kind B2 · utility
0Cited by
75References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2018 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Mar 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.