Deposition and treatment of films for patterning
US10319636B2 · kind B2 · utility
20Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2017 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Nov 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/266
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods comprising depositing a film material to form an initial film in a trench in a substrate surface are described. The film is treated to expand the film to grow beyond the substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.