Ziqing Duan
35Patents
6h-index
41Co-inventors
61Inventor score
Filing activity: Nov 20, 2014 → Jun 6, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10083834B2 | Methods of forming self-aligned vias | Electricity | 60 | Active |
| US10319636B2 | Deposition and treatment of films for patterning | Electricity | 20 | Active |
| US10319604B2 | Methods for self-aligned patterning | Electricity | 19 | Active |
| US10354916B2 | Methods for wordline separation in 3D-NAND devices | Electricity | 9 | Active |
| US10886172B2 | Methods for wordline separation in 3D-NAND devices | Electricity | 6 | Active |
| US10622251B2 | Methods for wordline separation in 3D-NAND devices | Electricity | 6 | Active |
| US9390910B2 | Gas flow profile modulated control of overlay in plasma CVD films | Electricity | 5 | Active |
| US9711360B2 | Methods to improve in-film particle performance of amorphous boron-carbon hardmask process in PECVD system | Electricity | 5 | Active |
| US10192775B2 | Methods for gapfill in high aspect ratio structures | Electricity | 5 | Active |
| US10100408B2 | Edge hump reduction faceplate by plasma modulation | Electricity | 3 | Active |
| US10418243B2 | Ultra-high modulus and etch selectivity boron-carbon hardmask films | Electricity | 3 | Active |
| US10403542B2 | Methods of forming self-aligned vias and air gaps | Electricity | 3 | Active |
| US10373822B2 | Gas flow profile modulated control of overlay in plasma CVD films | Electricity | 2 | Active |
| US10410872B2 | Borane mediated dehydrogenation process from silane and alkylsilane species for spacer and hardmask application | Electricity | 2 | Active |
| US10559497B2 | Seamless tungsten fill by tungsten oxidation-reduction | Electricity | 2 | Active |
| US10636659B2 | Selective deposition for simplified process flow of pillar formation | Electricity | 2 | Active |
| US10319591B2 | Geometric control of bottom-up pillars for patterning applications | Electricity | 2 | Active |
| US10854511B2 | Methods of lowering wordline resistance | Physics | 1 | Active |
| US11728168B2 | Ultra-high modulus and etch selectivity boron-carbon hardmask films | Electricity | 1 | Active |
| US9837265B2 | Gas flow profile modulated control of overlay in plasma CVD films | Electricity | 1 | Active |
| US11488856B2 | Methods for gapfill in high aspect ratio structures | Electricity | 0 | Active |
| US10128088B2 | Graded in-situ charge trapping layers to enable electrostatic chucking and excellent particle performance for boron-doped carbon films | Electricity | 0 | Active |
| US11094544B2 | Methods of forming self-aligned vias | Electricity | 0 | Active |
| US10971364B2 | Ultra-high modulus and etch selectivity boron carbon hardmask films | Electricity | 0 | Active |
| US10840186B2 | Methods of forming self-aligned vias and air gaps | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.