Face down dual sided chip scale memory package
US10366934B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2018 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Nov 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3862
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.