Selective deposition with surface treatment
US10378105B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2017 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | May 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2021/60052
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Embodiments of the invention provide methods for selective deposition on different materials using a surface treatment. According to one embodiment, the method includes providing a substrate containing a first material layer having a first surface and a second material layer having a second surface, and performing a chemical oxide removal process that terminates that second surface with hydroxyl groups. The method further includes modifying the second surface by exposure to a process gas containing a hydrophobic functional group, the modifying substituting the hydroxyl groups on the second surface with the hydrophobic functional group, and selectively depositing a metal-containing layer on the first surface but not on the modified second surface by exposing the substrate to a deposition gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.