Wave interface assembly for automatic test equipment for semiconductor testing
US10393772B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2016 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Jul 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/024
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure utilize customizable waveguide fabrication technologies (e.g., 3D printer technology) and patch antenna arrays to create adaptable wave interfaces that can provide efficient signal routing for an ATE system. In this fashion, embodiments of the present disclosure allow for arbitrary waveguide routing from port to port and create high density port spacing at the PCB level and which specifically eliminates the large flange required of prior art waveguides. Furthermore, embodiments include the ability to integrate different waveguide components, including power splitters, couplers, terminations, etc., into a single structure. Thus, embodiments of the present disclosure can reduce signal path losses and simplify the mechanical construction of ATE systems while eliminating the need for coax cables and minimizing the length of PCB microstrips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.