Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
US10418329B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2015 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Dec 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic structure includes a microelectronic substrate having a first surface and a cavity extending into the substrate from the microelectronic substrate first surface, a first microelectronic device and a second microelectronic device attached to the microelectronic substrate first surface, and a microelectronic bridge disposed within the microelectronic substrate cavity and attached to the first microelectronic device and to the second microelectronic device. In one embodiment, the microelectronic structure may include a reconstituted wafer formed from the first microelectronic device and the second microelectronic device. In another embodiment, a flux material may extend between the first microelectronic device and the microelectronic bridge and between the second microelectronic device and the microelectronic bridge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.