Reticle cooling by non-uniform gas flow
US10423081B2 · kind B2 · utility
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2References
24Claims
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Key dates
| Filing date | Dec 2, 2015 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | Dec 2, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70875
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus, system, and method cool a patterning device by supplying a non-uniform gas flow. The apparatus and system include a gas supply structure that supplies a gas flow across the first surface of the patterning device. The gas supply structure includes a gas supply nozzle specially configured to create a non-uniform gas flow distribution. A greater volume or velocity of the gas flow is directed to desired portion of the patterning device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.