High memory bandwidth neuromorphic computing system

US10423877B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Charles E. Cox · Fort Myers, US
• Harald Huels · Eppelheim, DE
• Arvind Kumar · Beaverton, US
• Pritish Narayanan · San Jose, US
• Ahmet S. Ozcan · Pleasantville, US
• J. Campbell Scott · Los Gatos, US
• Winfried W. Wilcke · Los Altos Hills, US

Key dates

• Filing date: Aug 15, 2016
• Grant date: Sep 24, 2019
• Expiry date: Apr 24, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15174
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Three-dimensional (3D) neuromorphic computing systems are provided. A system includes a logic wafer having a plurality of processors. The system further includes a double-sided interposer bonded to the logic wafer and incorporating a signal port ring for sending and receiving signals. The system also includes a plurality of 3D memory modules bonded to the double-sided interposer. The double-sided interposer is a wafer scale or a panel scale providing communication between the plurality of processors and the plurality of 3D memory modules.