Integrated circuit structures with recessed conductive contacts for package on package

US10424561B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Kyu Oh Lee · Chandler, US
• Islam A. Salama · Scottsdale, US
• Ram Viswanath · Phoenix, US
• Robert L. Sankman · Phoenix, US
• Babak Sabi · Portland, US
• Sri Chaitra Jyotsna Chavali · Chandler, US

Key dates

• Filing date: Jan 5, 2018
• Grant date: Sep 24, 2019
• Expiry date: Jan 5, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit (IC) structure includes a first IC package (ICP), including a first resist surface provided with a first plurality of conductive contacts (CCs), a first recess including a second resist surface disposed at a bottom of the recess and having a second plurality of CCs, and a second recess, including a third resist surface disposed at a bottom of the recess and provided with a fourth plurality of CCs. The IC structure further includes an IC component with a first surface and a second surface, the second surface having a third plurality of CCs coupled to the second plurality of CCs of the first ICP. The IC structure further includes a second ICP having a first surface and a second surface, with one or more CCs located at the second surface and coupled to at least one of the first plurality of CCs of the first ICP.