Patent · US Active

Chip package assembly with surface mounted component protection

US10438863B1 · kind B1 · utility

7Cited by

6References

20Claims

0Family size

Assignee

XILINX, INC. · US

Inventors

Ronilo Boja · Gilroy, US
Inderjit Singh · Saratoga, US

Key dates

Filing date	Sep 21, 2018
Grant date	Oct 8, 2019
Priority date	—
Expiry date	Sep 21, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/35
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip package assembly, a package substrate and methods for fabricating the same are disclosed herein. In one example, a chip package assembly includes a package substrate, an IC die and a stiffener. The package substrate includes a first dam projecting from a top surface of the package substrate. The IC die and the stiffener are mounted to the top surface of the package substrate. The stiffener includes a bottom surface that is disposed adjacent to the first dam. At least one surface mounted component is mounted to a region of the package substrate defined between the stiffener and the IC die. An adhesive coupling the stiffener to the package substrate is in contact with the first dam.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.