Method for direct bonding with self-alignment using ultrasound
US10438921B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2016 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Jul 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for direct bonding an electronic chip onto a substrate or another electronic chip, the method including: carrying out a hydrophilic treatment of a portion of, a surface of the electronic chip and of a portion of a surface of the substrate or of the other electronic chip; depositing an aqueous fluid on the portion of the surface of the substrate or of the second electronic chip; depositing the portion of the surface of the electronic chip on the aqueous fluid; drying the aqueous fluid until the portion of the surface of the electronic chip is rigidly connected to the portion of the surface of the substrate or of the other electronic chip: and during at least part of the drying of the aqueous fluid, emitting ultrasound into the aqueous fluid through the substrate or the other electronic chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.