Loic Sanchez
8Patents
1h-index
15Co-inventors
44Inventor score
Filing activity: May 9, 2007 → Jun 24, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10438921B2 | Method for direct bonding with self-alignment using ultrasound | Electricity | 2 | Active |
| US9240389B2 | Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone | Emerging Cross-Sectional Technologies | 1 | Active |
| US9586207B2 | Etching method for forming a carrier having inward side walls in particular for confining a droplet for capillary self-assembly | Electricity | 1 | Active |
| US7776716B2 | Method for fabricating a semiconductor on insulator wafer | Electricity | 1 | Active |
| US7846749B2 | Method and device for monitoring a heat treatment of a microtechnological substrate | Electricity | 0 | Active |
| US11694991B2 | Method for transferring chips | Electricity | 0 | Active |
| US8003550B2 | Method for revealing emergent dislocations in a germanium-base crystalline element | Electricity | 0 | Active |
| US9455174B2 | Device and method for individual support of components | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.