Apparatus and method to control properties of fluid discharge via refrigerative exhaust
US10443943B2 · kind B2 · utility
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3References
16Claims
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Key dates
| Filing date | Mar 29, 2017 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Jan 9, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28C3/06
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for controlling fluid discharge temperature on a semiconductor manufacturing tool. In this technique, the temperature is controlled via the use of refrigerative exhaust. This embodiment includes the hardware and controls to perform and monitor the described operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.