Laura Mauer
11Patents
2h-index
15Co-inventors
51Inventor score
Filing activity: Mar 28, 1988 → Jun 8, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9541837B2 | Apparatus and method for removing challenging polymer films and structures from semiconductor wafers | Electricity | 5 | Active |
| US9698062B2 | System and method for performing a wet etching process | Electricity | 3 | Active |
| USD316784S | Fabric feather | General | 1 | Expired |
| US10026660B2 | Method of etching the back of a wafer to expose TSVs | Electricity | 0 | Active |
| US10541180B2 | Apparatus and method for wafer thinning in advanced packaging applications | Electricity | 0 | Active |
| US9694436B2 | System and method for flux coat, reflow and clean | Performing Operations; Transporting | 0 | Active |
| US10443943B2 | Apparatus and method to control properties of fluid discharge via refrigerative exhaust | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US10446387B2 | Apparatus and method to control etch rate through adaptive spiking of chemistry | Electricity | 0 | Active |
| US10239031B2 | Apparatus and method for mixing fluids with degradational properties | Performing Operations; Transporting | 0 | Active |
| US10553502B2 | Two etch method for achieving a wafer thickness profile | Electricity | 0 | Active |
| US9333446B2 | Apparatus and method to remove undissolved solids from post process dry film strip solvents | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.