Patent assignee · US · COMPANY

VEECO PRECISION SURFACE PROCESSING LLC

17Patents
17Active
17Granted
50Portfolio score

Filing activity: Feb 28, 2013 → Jun 8, 2018

Most-cited patents

PatentTitleAreaCited byStatus
US9541837B2 Apparatus and method for removing challenging polymer films and structures from semiconductor wafers Electricity 5 Active
US9698062B2 System and method for performing a wet etching process Electricity 3 Active
US10559488B2 Two-level tape frame rinse assembly Electricity 2 Active
US10413850B2 Apparatus and method to remove solids from material lift off post process solvents Electricity 1 Active
US9870928B2 System and method for updating an arm scan profile through a graphical user interface Electricity 1 Active
US10443943B2 Apparatus and method to control properties of fluid discharge via refrigerative exhaust Mechanical Engineering; Lighting; Heating 0 Active
US9333446B2 Apparatus and method to remove undissolved solids from post process dry film strip solvents Performing Operations; Transporting 0 Active
US10026660B2 Method of etching the back of a wafer to expose TSVs Electricity 0 Active
US10503182B2 Apparatus and method for metals free reduction and control of resistivity of deionized water Chemistry; Metallurgy 0 Active
US10553502B2 Two etch method for achieving a wafer thickness profile Electricity 0 Active
US10446387B2 Apparatus and method to control etch rate through adaptive spiking of chemistry Electricity 0 Active
US10022745B2 Apparatus for dual speed spin chuck Electricity 0 Active
US10239031B2 Apparatus and method for mixing fluids with degradational properties Performing Operations; Transporting 0 Active
US9768041B2 Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle Electricity 0 Active
US10294132B2 Apparatus and method to reduce and control resistivity of deionized water Chemistry; Metallurgy 0 Active
US9694436B2 System and method for flux coat, reflow and clean Performing Operations; Transporting 0 Active
US10541180B2 Apparatus and method for wafer thinning in advanced packaging applications Electricity 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.