Patent · US Active

Method for producing electronic device with multi-layer contact

US10475761B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Alexander Heinrich · Bad Abbach, DE
Michael Juerss · Regenstauf, DE
Konrad Roesl · Teublitz, DE
Oliver Eichinger · Regensburg, DE
Kok Chai Goh · Melaka City, MY
Tobias Schmidt · Munich, DE

Key dates

Filing date	Sep 10, 2018
Grant date	Nov 12, 2019
Priority date	—
Expiry date	Sep 10, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1776
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing an electric device with a multi-layer contact is disclosed. In an embodiment, a method includes providing a carrier, the carrier having a metallic layer disposed on its surface, providing a semiconductor substrate, forming a layer stack on the semiconductor substrate and attaching the layer stack of the semiconductor substrate to the metallic layer of the carrier so that an intermetallic phase is formed between the metallic layer and the solder layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.