Oliver Eichinger
9Patents
1h-index
13Co-inventors
44Inventor score
Filing activity: Sep 27, 2010 → Nov 15, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8802553B2 | Method for mounting a semiconductor chip on a carrier | Electricity | 2 | Active |
| US9490193B2 | Electronic device with multi-layer contact | Electricity | 1 | Active |
| US9034751B2 | Method for mounting a semiconductor chip on a carrier | Electricity | 1 | Active |
| US11842975B2 | Electronic device with multi-layer contact and system | Electricity | 1 | Active |
| US8531014B2 | Method and system for minimizing carrier stress of a semiconductor device | Electricity | 0 | Active |
| US9735126B2 | Solder alloys and arrangements | Electricity | 0 | Active |
| US10930614B2 | Chip arrangements | Electricity | 0 | Active |
| US10475761B2 | Method for producing electronic device with multi-layer contact | Electricity | 0 | Active |
| US12255168B2 | Electronic device with multi-layer contact and system | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.