Measurement method comprising in-situ printing of apparatus mark and corresponding apparatus
US10481507B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
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Key dates
| Filing date | Aug 18, 2017 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Aug 18, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7084
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method, including printing an apparatus mark onto a structure while the structure is at least partly within a lithographic apparatus. The structure may be part of, or is located on, a substrate table, but is separate from a substrate to be held by the apparatus. The method further includes measuring the apparatus mark using a sensor system within the apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.