Split ball grid array pad for multi-chip modules
US10483233B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2017 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Jul 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip module, and method of fabricating the multi-chip module. The multi-chip module includes: a substrate containing multiple wiring layers, each wiring layer having first pads on a top surface of the substrate and second pads on a bottom surface of the substrate, wherein the second pads include split pad and a conventional pad; a first solder ball in direct physical contact with a contiguous bottom surface of the conventional pad and connected to a next level of packaging under the conventional pad, wherein the first solder ball has a first height; and a second solder ball in direct physical contact with first and second sections of the split pad separated by a gap, wherein the second solder ball has a second height that is sufficiently less than the first height such that the second solder ball is not connected to the next level of packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.