Substrate processing apparatus, method of cleaning substrate processing apparatus, and storage medium
US10486208B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2017 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Jan 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67173
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
According to the present disclosure, both first and second cup bodies are brought into a state of being close to each other by lifting one of the first and second cup bodies. A first gap between a gap forming portion formed on the lower surface of a first protruding portion and the upper surface of a second protruding portion is narrower than a second gap between a portion of the first protruding portion where the gap forming portion is absent, and the upper surface of the second protruding portion. In this state, a cleaning liquid is supplied to the second gap. Since movement of the cleaning liquid that tends to flow radially outward is restricted by the first narrow gap, the entire area between the first and second protruding portions may be filled with the cleaning liquid so that the surface to be cleaned may be evenly cleaned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.