Cooling element for an electrostatic chuck assembly
US10490435B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2018 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Feb 7, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck assembly with improved thermal uniformity and stability is disclosed herein. The electrostatic chuck assembly includes a puck having a chucking electrode disposed therein and a cooling base connected to the puck. The cooling base is formed a first material and includes a top surface, a first cooling channel, a second cooling channel configured to flow coolant therethrough independent of flow through the first cooling channel, and a first thermal spreading element aligned with the first cooling channel and disposed between the first cooling channel and the puck. The first thermal spreading element is formed from a second material that has a thermal conductivity higher than a thermal conductivity of the first material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.