Substrate processing apparatus, substrate processing method, and storage medium
US10504718B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2017 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Feb 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
During at least part of a time period for a pressure increasing step of increasing a pressure inside a processing container from a pressure lower than a critical pressure of a processing fluid to a pressure higher than the critical pressure, pressure increasing is performed by supplying the processing fluid into the processing container from a fluid supply source while discharging the processing fluid from the processing container at a controlled discharge flow rate. Particles attached to the surfaces of members inside the processing container travel upward by the supply of the processing fluid into the processing container from the fluid supply source. The particles are discharged along with the processing fluid from the processing container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.