Electrostatic chuck assembly having a dielectric filler
US10504765B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2017 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Nov 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments include an electrostatic chuck assembly having an electrostatic chuck mounted on an insulator. The electrostatic chuck and insulator may be within a chamber volume of a process chamber. In an embodiment, a ground shield surrounds the electrostatic chuck and the insulator, and a gap between the ground shield and the electrostatic chuck provides an environment at risk for electric field emission. A dielectric filler can be placed within the gap to reduce a likelihood of electric field emission. The dielectric filler can have a flexible outer surface that covers or attaches to the electrostatic chuck, or an interface between the electrostatic chuck and the insulator Other embodiments are also described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.