Chemical mechanical polishing smart ring
US10513008B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2017 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Feb 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q2209/88
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, and a sensor assembly. The retaining ring is coupled to the body. The sensor assembly is positioned at least partially in the body. The sensor assembly includes a transmitter, an antenna, and a vibrational sensor. The transmitter has a first end and a second end. The antenna is coupled to the first end of the transmitter. The vibrational sensor is coupled to the second end. The vibrational sensor is configured to detect vibration during chemical mechanical processes with respect to radial, azimuthal, and angular axes of the carrier head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.