Substrate having a conductive structure within photo-sensitive resin
US10515884B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2015 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Apr 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a semiconductor substrate structure, semiconductor package and method of manufacturing the same. The semiconductor substrate structure includes a conductive structure, a dielectric structure and a metal bump. The conductive structure has a first conductive surface and a second conductive surface. The dielectric structure has a first dielectric surface and a second dielectric surface. The first conductive surface does not protrude from the first dielectric surface. The second conductive surface is recessed from the second dielectric surface. The metal bump is disposed in a dielectric opening of the dielectric structure, and is physically and electrically connected to the second conductive surface. The metal bump has a concave surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.