Metrology apparatus, method of measuring a structure, device manufacturing method
US10599048B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2018 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Oct 24, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7023
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Metrology apparatus and methods are disclosed for measuring a structure formed on a substrate. In one arrangement, different components of a radiation beam are selectively extracted after reflection from the structure and independently detected. For each component, radiation is selected from one of a plurality of predetermined regions in a downstream pupil plane of the optical system downstream from the structure. Radiation is further selected from one of two predetermined orthogonal polarization states. The predetermined orthogonal polarization states are oriented differently as a pair for each of at least a subset of components comprising radiation selected from different predetermined regions in the downstream pupil plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.