Patent · US Active

Wafer and method for processing a wafer

US10600701B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gunther Mackh · Dresden, DE
Gerhard Leschik · Regensburg, DE
Maria Heidenblut · Schwarzenfeld, DE

Key dates

Filing date	Sep 4, 2018
Grant date	Mar 24, 2020
Priority date	—
Expiry date	Sep 4, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68336
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A wafer in accordance with various embodiments may include: at least one metallization structure including at least one opening; and at least one separation line region along which the wafer is to be diced, wherein the at least one separation line region intersects the at least one opening.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.