Gerhard Leschik
6Patents
0h-index
7Co-inventors
30Inventor score
Filing activity: Sep 28, 2011 → Sep 4, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9356092B2 | Semiconductor device and method for manufacturing a semiconductor device | Electricity | 0 | Active |
| US8704338B2 | Chip comprising a fill structure | Electricity | 0 | Active |
| US9040354B2 | Chip comprising a fill structure | Electricity | 0 | Active |
| US10090214B2 | Wafer and method for processing a wafer | Electricity | 0 | Active |
| US10600701B2 | Wafer and method for processing a wafer | Electricity | 0 | Active |
| US8809165B2 | Method for fusing a laser fuse and method for processing a wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.