Method for making CMOS image sensor including stacked semiconductor chips and image processing circuitry including a superlattice

US10608027B2 · kind B2 · utility

Assignee

• ATOMERA INCORPORATED · US

Inventors

• Yi-Ann Chen · Campbell, US
• Abid Husain · San Jose, US
• Hideki Takeuchi · Sakaki, JP

Key dates

• Filing date: Dec 15, 2017
• Grant date: Mar 31, 2020
• Expiry date: Dec 15, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/199

Abstract

A method for making a CMOS image sensor may include forming a first semiconductor chip including an array of image sensor pixels and readout circuitry electrically connected thereto, forming a second semiconductor chip including image processing circuitry electrically connected to the readout circuitry, and coupling the first semiconductor chip and the second semiconductor chip in a stack. The processing circuitry may include a plurality of transistors each including spaced apart source and drain regions, a superlattice channel extending between the source and drain regions, and a gate including a gate insulating layer on the superlattice channel and a gate electrode on the gate insulating layer.