Patent · US Active

Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet

US10615097B2 · kind B2 · utility

0Cited by

2References

23Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Andreas Grassmann · Villach, AT
Wolfram Hable · Dresden, DE
Juergen Hoegerl · Regensburg, DE
Angela Kessler · Regensburg, DE
Ivan Nikitin · Regensburg, DE
Achim Strass · Munich, DE

Key dates

Filing date	Oct 12, 2017
Grant date	Apr 7, 2020
Priority date	—
Expiry date	Dec 4, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip carrier which comprises a thermally conductive and electrically insulating sheet, a first electrically conductive structure on a first main surface of the sheet, and a second electrically conductive structure on a second main surface of the sheet, wherein the first electrically conductive structure and the second electrically conductive structure extend beyond a lateral edge of the sheet.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.