Patent · US Active

ALD method and apparatus

US10619241B2 · kind B2 · utility

1Cited by
3References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 25, 2015
Grant dateApr 14, 2020
Priority date
Expiry dateNov 25, 2035

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C16/483
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method that includes performing an atomic layer deposition sequence including at least one deposition cycle, each cycle producing a monolayer of deposited material, the deposition cycle including introducing at least a first precursor species and a second precursor species to a substrate surface in a reaction chamber, wherein both of said first and second precursor species are present in gas phase in said reaction chamber simultaneously.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.