ALD method and apparatus
US10619241B2 · kind B2 · utility
1Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2015 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Nov 25, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/483
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method that includes performing an atomic layer deposition sequence including at least one deposition cycle, each cycle producing a monolayer of deposited material, the deposition cycle including introducing at least a first precursor species and a second precursor species to a substrate surface in a reaction chamber, wherein both of said first and second precursor species are present in gas phase in said reaction chamber simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.