Patent · US Active

Segmented edge protection shield

US10622218B2 · kind B2 · utility

0Cited by

6References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Manfred Engelhardt · Feldkirchen-Westerham, DE
Michael Roesner · Villach, AT
Georg Ehrentraut · Villach, AT

Key dates

Filing date	Sep 18, 2017
Grant date	Apr 14, 2020
Priority date	—
Expiry date	Sep 18, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/78
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A segmented edge protection shield for plasma dicing a wafer. The segmented edge protection shield includes an outer structure and a plurality of plasma shield edge segments. The outer structure defines an interior annular edge configured to correspond to the circumferential edge of the wafer. Each one of the plurality of plasma shield edge segments is defined by an inner edge and side edges. The inner edge is interior to and concentric to the annular edge of the outer structure. The side edges extend between the inner edge and the annular edge.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.