3D circuit transistors with flipped gate
US10651202B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2018 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Nov 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/85
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit is provided with several superimposed levels of transistors, the circuit including an upper level provided with transistors having a rear gate electrode laid out on a first semiconducting layer, and a second semiconducting layer, a first transistor among the transistors of the upper level being provided with a contact pad traversing the second semiconducting layer, the contact pad being connected to a connection zone disposed between the first semiconducting layer and the second semiconducting layer, the first transistor being polarised by and connected to at least one power supply line disposed on a side of a front face of the second semiconducting layer that is opposite to the rear face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.