Conical wafer centering and holding device for semiconductor processing
US10655224B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2016 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Apr 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32642
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor system includes a chamber, a pedestal disposed in the chamber, and a focus ring that surrounds the pedestal. The pedestal has a center region for supporting a central region of a substrate, e.g., a wafer. The focus ring is configured to surround the center region of the pedestal. The focus ring has an annular support region that extends between an inner portion of the focus ring and an outer portion of the focus ring. The annular support region, which is disposed at an angle relative to a horizontal line, provides a knife-edge contact for the substrate when present over the center region of the pedestal and the annular support region of the focus ring. The knife-edge contact between the edge of the substrate and the annular support region of the focus ring disables chemical access to the substrate backside and thereby reduces unwanted backside deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.