Moveable edge coupling ring for edge process control during semiconductor wafer processing
US10658222B2 · kind B2 · utility
4Cited by
13References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2015 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Jun 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate processing system includes a processing chamber and a pedestal arranged in the processing chamber. An edge coupling ring is arranged adjacent to a radially outer edge of the pedestal. A first actuator is configured to selectively move the edge coupling ring to a raised position, relative to the pedestal to provide clearance between the edge coupling ring and the pedestal to allow a robot arm to remove the edge coupling ring from the processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.